Isu Petasys gives up plan to buy JEIO
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Samsung year-end reshuffle focuses on chip division amid ‘crisis’
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DeepX to receive DX-M1 wafer at end of year
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Samsung succeeds in reducing use of PR during 3D NAND lithography
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TCK wins SiC patent lawsuits against YMC, Wycom
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South Korea’s Mdevice approved to go public
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SK Hynix begins 321-layer NAND production
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Point2 Technology expects over 1 trillion won in valuation when it lists on Kosdaq
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YEST to supply eFurnace used in HBM production to SK Hynix
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Telechips to focus on mid-end auto chips
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