SK Hynix develops 61TB SSD for AI data centers
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Park Systems’ AFM in high demand thanks to rise of hybrid bonding
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Samsung to manufacture Exynos 2500 for Galaxy Z Flip next year
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LB Semicon and LB Lusem to package power chips aimed at AI data centers
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3ALogics to launch a dozen of new NFC chips next year
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FOUP cleaner ISTE to also expand into PECVD
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SK Hynix beefs up executive team amid high number of promotions
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LB Semicon, DB Hitek to co-develop power chip
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Samsung to change packaging method of low-power DRAM used in iPhones
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Samyang NC Chem’s serial violation draws concern before IPO
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