Samsung to supply DRAMs for OpenAI’s Stargate project
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South Korean fab equipment makers line up for hybrid bonding competition
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Hyundai Mobis to launch over 10 new auto chips in next 2 to 3 years
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Meta expected to use DB Hitek PMIC for AR glasses
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Hyper Accel to launch 4nm language processing unit next year
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Hanmi Semiconductor expects HBM hybrid bonder sales to start in 2027
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Samsung outsources memory chip photomask production for the first time
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HBM heat dissipation key to reliability in AI age, says professor
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SK Hynix completes development of HBM4
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SK Hynix’s precursor supplier suffers from factory fire
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