SK Hynix to double production rate for 1c DRAM by early 2027
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SK Hynix to supply HBM3E for Microsoft Maia 200 AI chip
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Samsung’s consumer memory prices triple in 2 months
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Samsung’s development phase for HBM4E reaches base die back-end design
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SK Hynix expected to post record profits in Q4
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TSE to supply HBM probe card to major memory companies
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Samsung to close down one of its 8-inch foundry fabs within the year
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SK Hynix to spend 19 trillion won in new chip packaging fab
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Samsung to supply 5G modem to Tesla for Robotaxi
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LG starts development of hybrid bonder for HBM
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